Price range: £52.10 through £313.50 + VAT
Gold Flash plating solution allows you to plate a 24 carat gold thin coating of gold. It’s an economical alternative to full gold plating thin, decorative deposits on items such as costume jewellery.
Gold content: 2 grams per litre.
HS Code: 3824 99 70
Gold Flash used to prepare nickel-silver vesta case for silver plating
Our Gold Brush Plating Kit is a great choice to get started with gold brush plating. It is based around our EasyPlater, a power source designed and made by us at Spa Plating. If you’re working to a budget and only intending to plate flash layer’s of gold, Gold Flash Brush Plating Solution can be substituted for Gold Brush Plating Solution in this kit.
Here is a video showing how to use our gold brush plating kit;
Back to Product DescriptionGold Flash Brush Plating Solution produces a thin decorative coating of 24 karat gold. It contains 2 grams per litre of gold and is particularly suitable where only a flash coating is required.
It is an economical choice for costume jewellery, decorative items, small repairs and other applications where a substantial thickness of gold is not required.
Gold Flash Brush Plating Solution is designed for selective and localised gold plating. It can be used with the same brush plating equipment as our standard Gold Brush Plating Solution.
Gold Flash should not be regarded simply as a lower-cost replacement for Gold Brush Plating Solution. Gold Flash is intended for thin decorative coatings, whereas Gold Brush Plating Solution is the better choice where a more substantial gold coating is required or the item will be subject to regular handling or wear.
Gold plates very readily over silver and Gold Flash can be applied directly to a properly prepared silver surface. This makes it particularly useful where only a thin decorative gold finish is required over an existing silver coating.
Gold Flash can also be useful as a thin initial gold layer in some plating processes before another metal or a thicker gold coating is applied.
For example, a thin layer of Gold Flash can be used as an intermediate layer when silver plating brass or steel where improved adhesion is required.
Only a thin coating of Gold Flash is required when it is being used for this purpose. The subsequent plating process is then used to build the required finish or thickness.
Gold Flash can be brush plated directly onto nickel and nickel alloys, particularly for decorative applications where perfect adhesion is not critical.
Nickel and nickel alloys are best prepared with MPU before plating. See the Process Sequences tab for further information.
Correct surface preparation is essential for good adhesion. The preparation and any intermediate plating layers required depend on the underlying metal.
See the Process Sequences tab for the recommended preparation and plating processes for commonly encountered surfaces.
Operating Conditions and Deposit Data
| Voltage Range | 4.0 – 6.0 volts |
| Temperature | 14 – 25 °C |
| Gold Concentration | 2g/l |
| Electrode | Platinum or Carbon (see notes) |
| Gold content in plate | 99.9% (balance carbon) |
| Plating Rate at (5.0 volts, Platinum electrode) | Approx. 0.12 micron per minute (spot) |
| Hardness | 180 – 190 Hv |
| Density of deposit | 19.3 g/cm3 |
| Stress | Low – medium stress |
| Special storage requirements | Away from sunlight |
| Shelf life | Over 3 years |
Notes:
Certain small items, for example Swabs, Nibs and Plating Pens can be sent by normal post within the UK
For all price quotations for deliveries, please add your items to our shopping cart. You will be able to see the shipping costs by clicking on the ‘Calculate shipping’ button in the cart and before checking out.
Please click on the link below to download the SDS for this product:
Fault |
Possible cause |
Diagnostic clue |
Corrective action |
No plating at all |
Open circuit | The MultiPlater shows a continuous red indication. With a conventional power supply, the amps remain at zero. | Check the connection to the workpiece, electrode and leads. Make sure the swab is fully wetted with plating solution. If the conductivity of the surface is uncertain, check it with a Conductivity Tester. |
| Connections reversed | The MultiPlater may still show green and a conventional power supply may still show amps, but no gold is deposited. | Correct the polarity. Nickel and stainless steel will usually need to be reactivated. Brass and copper may have been etched and may need repolishing before replating. | |
| Swab not fully wetted | No current flows because the plating solution is not providing electrical contact between the electrode and the workpiece. | Fully wet the swab with Gold Flash Brush Plating Solution. | |
| Plating directly onto a PVD coating | Little or no gold deposits. Irregular swirling or streaking may occur and the swab may darken or become gold-coloured as particles of the PVD coating detach. | Remove the PVD coating completely and prepare the underlying surface before plating. | |
| Plating directly onto a passive or difficult-to-plate metal or alloy | There is electrical contact but little or no plating takes place. | Use the appropriate preparation process for the underlying metal. Refer to the Process Sequences tab. | |
| Platinum coating on the electrode completely worn away | The MultiPlater shows a continuous red indication, or a conventional power supply shows zero amps, even though the connections are sound. | Replace the electrode. Use a platinum or suitable carbon electrode. | |
| Existing clear coat or E-coating | A clear insulating coating prevents electrical contact and may be difficult to see. | Remove the coating completely, then prepare the underlying surface before plating. A Conductivity Tester can be used to check the surface. | |
Plating is slow |
Gold content depleted | The plating rate gradually becomes slower after repeated use of the solution. | Use fresh Gold Flash Brush Plating Solution or increase the voltage gradually within the recommended 4.0–6.0 V operating range. |
| Swab not fully wetted or saturated | Plating improves immediately after more solution is applied to the swab. | Keep the swab fully wetted with plating solution throughout plating. | |
| Swab too small for the area being plated | Plating a relatively large area takes considerably longer than expected with a small swab. | Use a larger swab appropriate to the area being plated. | |
| Voltage too low | Plating takes place normally but at a low rate. | Increase the voltage within the recommended 4.0–6.0 V operating range. | |
| Swab making inconsistent contact | The plating rate varies as the swab is moved over the workpiece. | Maintain light, continuous contact between the wetted swab and the workpiece. | |
| Solution or workpiece too cold | Plating is slower when the solution or workpiece is below the recommended temperature range. | Allow the solution and workpiece to reach the recommended operating temperature of 14–25°C. | |
| Expecting the same plating rate as Gold Brush Plating Solution | Plating is progressing normally but appears slow, particularly to someone accustomed to using Gold Brush Plating Solution. | Gold Flash Brush Plating Solution is substantially slower. At 5.0 V using a platinum electrode, the approximate spot plating rate is 0.12 µm/min. Use the Brush Plating Calculator to estimate the plating time for the area and thickness required. | |
| High resistance connection | A poor or oxidised electrical connection restricts the amps and may become warm or hot during use. | Switch off the power and check, clean or replace the affected connection. | |
Plating is patchy or uneven |
Insufficient activation where activation is required | Patchy plating occurs on passive metals such as nickel, stainless steel or Monel. | Repeat the appropriate activation process. Keep the freshly activated surface wet and proceed directly to plating. |
| Surface not properly cleaned | Gold avoids particular areas or forms an irregular deposit. | Repeat the cleaning and appropriate surface preparation process before replating. | |
| Plating directly onto a PVD coating | The deposit is irregular, streaky or poorly attached. | Remove the PVD coating completely and prepare the underlying surface before plating. | |
| Residual brighteners or strong residues from previous tank plating | Patchiness occurs over a previously tank-plated surface, particularly silver. | Remove residual surface films. Rub the surface with MPU where practical, rinse and proceed directly to plating. | |
| Swab contaminated from a previous process | Patchiness appears after a swab has previously been used with another plating solution or preparation chemical. | Use a clean swab reserved for Gold Flash Brush Plating Solution. | |
| Clear coat or E-coating only partially removed | Gold plates onto exposed conductive areas but not onto areas where the insulating coating remains. | Remove the coating completely before preparing and plating the underlying surface. | |
Deposit is dark/brown/burnt |
Brushing action too slow or incorrect | Dark or discoloured areas develop during plating, particularly where the swab is moving slowest relative to the workpiece. | Increase the brushing speed and use a continuous circular motion. |
| Iron contamination | The deposit develops an abnormal grey-brown colour, particularly where an unsuitable stainless steel electrode has been used. | Stop using the stainless steel electrode, discard contaminated solution and use a platinum or suitable carbon electrode. | |
Plating is dull |
Gold Flash deposit too thick | The deposit is initially bright but becomes progressively dull as more gold is applied. Gold Flash contains no brightener and normally remains bright up to approximately 0.2–0.3 µm. By around 0.5 µm it is completely dull. | This is normal behaviour and is not a solution fault. Stop plating when the required bright flash has been obtained. If a thicker bright gold deposit is required, use a gold plating solution designed for greater thickness. |
| Underlying surface dull or porous | The deposit is uniformly dull from the beginning and reproduces the finish of the underlying surface rather than becoming progressively dull with increasing thickness. | Polish to the required finish using MPU Coarse, MPU or MPU Fine as appropriate. Rinse and continue plating without allowing the surface to dry. If a proprietary metal polish such as Autosol is used, repeat the cleaning and appropriate activation process before plating. | |
Plating fails the adhesive tape test or peels |
Existing plating or coating is poorly adhered | The plating fails the adhesive tape test or peels. Examine the underside of the material removed by the tape. Its colour can help identify which plated layer has failed. For example, a gold-coloured underside indicates failure at the gold interface, while a silver or copper-coloured underside indicates that the silver or copper plated layer respectively has failed at the interface beneath it. There may already be signs of blistering, flaking or delamination before gold plating. | Remove all loose or poorly adhered plating back to a sound surface before replating. A new gold layer cannot improve the adhesion of an unstable coating underneath it. |
| Passive oxide layer not properly removed before plating | Gold Flash plates onto nickel, stainless steel, Monel or another passive surface but subsequently fails the adhesive tape test. | Remove the poorly adhered Gold Flash and repeat the appropriate preparation process for the underlying metal. Most importantly, keep the freshly activated surface wet and proceed directly to Gold Flash plating without allowing it to dry. | |
| Surface contaminated before Gold Flash plating | The Gold Flash appears to plate normally but fails the adhesive tape test. Where Gold Flash has been applied over silver, a gold-coloured underside to the removed film confirms failure at the gold/silver interface. | Remove the poorly adhered Gold Flash and thoroughly clean the underlying surface to remove grease, polishing residues or other contamination. Rinse thoroughly and replate. Clean silver and gold surfaces can be Gold Flash plated without activation. | |
Deposit colour is wrong |
Gold Flash deposit is too thin | The gold colour is weaker or paler than expected and the colour of the underlying metal is still influencing the appearance. | Continue plating until the required gold colour is obtained, remembering that Gold Flash is intended for very thin deposits and begins to dull as the thickness increases beyond approximately 0.2–0.3 µm. |
| Underlying surface colour is influencing the appearance | The Gold Flash has deposited evenly, but the final appearance is influenced by the colour of the metal or plating underneath. | Where colour consistency is important, use a suitable intermediate layer to provide a uniform underlying colour before applying Gold Flash. | |
| Solution contaminated with another metal | The deposit develops an abnormal colour even though plating otherwise appears normal. | Prevent carry-over between plating processes. Use clean swabs and rinse the work thoroughly between stages. Replace significantly contaminated Gold Flash Brush Plating Solution. | |
| Incorrect electrode material | The deposit develops an abnormal colour during plating. | Use a platinum or suitable carbon electrode. Replace the solution if it has become significantly contaminated by an unsuitable electrode. | |
Poor coverage |
Swab not fully wetted with plating solution | Plating is intermittent or absent in some areas because electrical contact through the plating solution is being lost. | Make sure the swab is fully wetted with Gold Flash Brush Plating Solution and remains wet throughout plating. |
| Swab too small for the area being plated | Some areas receive considerably more contact time than others, resulting in visibly uneven coverage over a larger surface. | Use a larger swab appropriate to the area being plated, or work systematically over the surface to maintain even coverage. | |
| Brushing pattern does not cover the whole area evenly | Areas repeatedly passed over by the swab develop a stronger gold colour while areas receiving less contact remain noticeably lighter. | Use overlapping, continuous strokes and work systematically over the whole area so that each part receives approximately the same plating time. | |
| Expecting the same coverage from the solution as Gold Brush Plating Solution | The Gold Flash appears to cover less area for a given volume of solution than expected, particularly when compared with Gold Brush Plating Solution. Gold Flash contains only 2 g/L gold and is intended for very thin deposits. | This is normal for Gold Flash Brush Plating Solution. Allow for its lower gold content when estimating how much solution will be required to plate a given area. Use the Brush Plating Calculator to estimate the quantity required. | |
Speckled plating |
Copper migrating through a very thin gold deposit | Small reddish or darker specks develop where Gold Flash has been applied directly over copper, brass or another copper-containing surface. | Use a suitable barrier layer between the copper-containing surface and the Gold Flash where required. |
| Contamination or particles on the surface or swab | Individual spots or specks appear during plating rather than an overall colour change. | Clean and rinse the work thoroughly and use a clean swab. Replace contaminated solution where necessary. | |
Scratchy plating |
Swab contaminated with hard particles | Fine scratches appear during plating and tend to follow the movement of the swab. | Stop plating and replace the swab. Make sure the workpiece and electrode are clean before continuing. |
| Swab worn or damaged | Scratching develops after the swab has been used for some time, particularly where the electrode is beginning to become exposed through the swab. | Replace the worn swab. Make sure the electrode cannot contact the workpiece directly during plating. | |
| Excessive pressure applied to the swab | Scratches or drag marks develop in the direction of brushing, particularly on softer underlying surfaces. | Reduce the pressure on the swab. Maintain light, continuous contact while plating. | |
Incorrect plating thickness |
Plating time incorrect | The deposit is thinner or thicker than intended even though plating otherwise appears normal. | Use the Brush Plating Calculator to determine the approximate plating time for the area and required thickness. |
| Voltage different from that assumed | The plating rate is faster or slower than expected. | Check the applied voltage. Gold Flash operates at 4.0–6.0 V; the quoted spot plating rate of approximately 0.12 µm/min is based on 5.0 V using a platinum electrode. | |
| Swab movement or contact time uneven | Thickness varies across the plated area, with areas receiving more swab contact becoming thicker. | Use continuous, overlapping strokes and work systematically so that each part of the surface receives approximately the same plating time. | |
| Gold content of solution depleted through use | The calculated plating time increasingly produces a thinner deposit as the solution is used. | Allow for the reduced plating rate as the gold is depleted, or replace the solution when accurate thickness control becomes important. |
Gold Flash can be brush plated directly onto nickel and nickel alloys, particularly for decorative applications where perfect adhesion is not critical. MPU is the preferred preparation method.
Build up the copper layer with Copper Tank where service conditions require additional protection, for example for items exposed to outdoor conditions.
Build up the copper layer with Copper Tank where service conditions require additional protection, for example for items exposed to outdoor conditions.
After degreasing, use MPU to provide the final clean and activation in one process. Rinse and proceed directly to plating without allowing the surface to dry.
After degreasing, clean the surface using Cleaner, rinse, then activate using Activator. Rinse and proceed directly to plating without allowing the surface to dry.
After degreasing, Acticlean can be used as the combined cleaning and activation process. Rinse and proceed directly to plating without allowing the surface to dry.
Copper, brass and other copper alloys require a barrier layer before gold plating. Nickel, silver or palladium can be used. Palladium is particularly suitable for jewellery and other items in prolonged contact with the skin, where it can be used instead of nickel to reduce the risk of contact dermatitis.
