Gold Strike Brush and Tank

Price range: £47.63 through £330.13 + VAT

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Delivery to the UK only – see delivery information

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You can use this plating solution for both brush and tank plating. Gold Strike Brush and Tank plates on to difficult-to plate metals such as chrome (see process sequences tab), surgical steel and dental alloys and it achieves good adhesion with the brush plating method.

This solution is nickel-free, so it’s safe for plating items that will come into contact with skin.

You can use this plating solution as an adhesive undercoat when plating onto difficult-to-plate metals such as surgical steel and tungsten or as a decorative gold layer.

For operating conditions, click on ‘Tech Specs’ tab.

Gold concentration: 2 grams per litre

HS Code: 3824 99 70

This photograph shows a sellotape test of a gold strike layer after brush plating a chrome plated lighter. This demonstrates just how adhesive this plating solution is when you use the brush plating method. In section A of the picture, you can see the tape sticking to the surface of our freshly plated gold strike layer and then in section B of the picture, we quickly remove the tape. The gold layer stays on the surface of the work with no traces of gold on the sellotape.

NB – you can’t achieve the same level of adhesion with the tank plating method.

 

Our Gold Strike plates layers of gold straight on to difficult to plate stainless steel alloys and chrome without stripping. It is particularly useful for brush plating super adherent key layers. Please use a Carbon Electrode, which you can buy by clicking on the link in the ‘Related Products’ section below this panel.You can also plate other difficult to plate metals such as tungsten with our Gold Strike Brush and Tank.

Here’s a shot of some stainless surgical steel nose rings we plated with our Gold Strike Brush and Tank. Because this solution doesn’t contain nickel it is safe to use if the item comes into contact with skin.

This disk is an example of Inconel 718, another difficult to plate allloy. We first plated it with the gold strike brush and tank and then finally with our silver tank plating solution.

Our MultiPlater is the ideal choice for powering your gold brush plating. This power source is designed and made by us at Spa Plating and is really straightforward to use and can be used for brush, pen and tank plating.

Here’s a video showing how to brush plate straight onto chrome with our Gold Strike;

Here’s another video showing how to use the same solution to tank plate onto stainles steel;

Here’s a list of the main products used in this video;

MultiPlater

Plating Stand

Plating Arm and Boss

Cleaner

Stainless Mesh Electrode

Magnetic Stirrer

Red Jump Lead
Red Combination Lead
Black Jump Lead
Black Combination Lead

Back to Product Description

Gold Strike Brush and Tank Calculator

How to use this calculator:

First, select Brush or Tank. This calculator is specifically for Gold Strike.

Brush plating

  1. Enter the surface area you are plating in cm².
  2. Enter the required thickness in microns.
  3. Select the swab you are using.
  4. Click ‘Calculate’. The results show the volume of solution required, the time in hours:minutes:seconds and the weight of gold plated.

The solution volume includes an allowance for wetting the selected swab. The plating time allows for the surface area and the size of the swab.

Tank plating

  1. Enter the required thickness in microns.
  2. Enter the surface area you are plating in cm².
  3. Click ‘Calculate’. The results show the amp setting, plating time, Coulombs required, Gold Strike Tank Replenisher required and the weight of gold plated.

If you are using a coulometer, use the Coulombs result as your target charge.

Both methods show the estimated weight of gold deposited. Suitable accurate scales can help you check the actual weight gain.

Click ‘Print Page’ to print a report of your inputs and results.

Gold Strike Brush and Tank – Tech Specs

Operating conditions and deposit data for tank plating
(scroll down for brush plating operating conditions)

Plating Factor 0.01 to 0.1 A/cm² (recommended: 0.03 A/cm²)
Cathode efficiency 3.6% (at 0.03 A/cm², 20°C, moderate agitation)
Plating rate at 0.03 A/cm² 0.07 micron per minute (at 20°C)
Recommended plating thickness 20 microns have been achieved on pure silver
0.1 micron on chromium and surgical stainless steel
Temperature 18 – 40 °C
pH >= 1.5
Gold concentration 2 grams per litre
Agitation Medium (by hand or stirrer bar)
Electrode Platinum Rod Electrode for Beaker Plating, preferably fitted with an Anode Bag
Gold content in plate 99.5% – 100%
Deposit characteristics Bright, non-levelling
Hardness 190 – 210 Hv
Density of deposit 19.3 g/cm³
Stress Medium (tensile)
Special storage requirements Away from sunlight
Shelf life 1 – 2 years
Health and Safety classification Harmful
Special considerations None
Transport (UN number) 2796

Notes:

  • For optimum adhesion especially when plating onto chrome and surgical stainless steel,
    prepare article with MPU prior to plating.
  • Plating rate increases with temperature.

 

Operating conditions and deposit data for brush plating

Voltage 3 – 4 volts
Temperature 18 – 40 °C
Gold Concentration 2 g/l
Electrode Carbon or platinum
Gold content in plate 99.5% – 100%
Plating Rate at (3 volts, Carbon Electrode,
20 °C)		 0.07 micron per minute (spot)
Plating Rate at (4 volts, Carbon Electrode,
20 °C)		 0.09 micron per minute (spot)
Recommended plating thickness 20 microns have been achieved on pure silver
0.1 micron on chromium and surgical stainless steel
Coverage 10ml should cover 80 cm² to 0.1 micron
Hardness 185 Hv
Density of deposit 19.3 g/cm³
Stress Medium (tensile)
Special storage requirements Away from sunlight
Shelf life 1 – 2 years
Health and Safety classification Harmful
Special considerations None
Transport (UN number) 2796

Notes:

  • For optimum adhesion especially when plating onto chrome and surgical stainless steel,
    prepare article with MPU prior to plating.
  • Plating rates are calculated over a sample area which is permanently covered by swab.

This product cannot be transported outside the UK because it is UN classified for transport.

  • APC: Delivery usually takes 2–7 working days from dispatch.
  • Free UK mainland delivery: We offer free delivery on UK mainland orders over £200.
  • International delivery: Not available on this product.

Where available, we list alternative or substitute products on the product page or under Related Items below the tabbed panel.

Shipping costs: Add the items you require to your shopping cart, where you can calculate the delivery charge before checking out.

Please click on the link below to download the SDS for this product:

https://goldn.co.uk/msds/gold_strike_brush_and_tank.pdf

Gold Strike Brush and Tank – Troubleshooting Plating Faults

Gold Strike Brush and Tank can be used for both tank plating and brush plating. Tank plating faults are covered in the first table and brush plating faults in the second. Use the Gold Strike Calculator to work out plating times, amp settings and the volume of solution required.

Tank plating

Fault

Possible cause

Diagnostic clue

Corrective action
No plating at all (tank plating)
 Open circuit / electricity not flowing If you are using a MultiPlater, the red light remains on, indicating that no current is flowing. A conventional power supply will show zero amps. Check all electrical connections and contact points, and clean the contact points if necessary. If you are unsure whether the surface itself is electrically conductive, check it with the Conductivity Tester before continuing.
Reverse polarity Current may still flow, but gold does not deposit. The workpiece may show signs of being etched. Correct the polarity: workpiece negative (–), platinum rod electrode positive (+). Chrome and stainless steel will usually only need to be reactivated.
Trying to plate directly onto a PVD coating Gold Strike plates directly onto chrome, but PVD coatings are often mistaken for chrome or gold plate. Little or no gold may deposit, or irregular swirling or streaked marks may appear across the surface. We advise against plating directly onto the PVD coating. Remove the PVD coating completely, then prepare and plate the underlying surface.
Existing clear coat, lacquer or E-coating on the surface A continuous clear insulating coating prevents electrical contact with the underlying metal, so no gold plates. With a MultiPlater, the indicator remains red because no current is flowing. The coating can be difficult to see and the underlying surface may still look metallic. Completely remove the coating to expose the underlying metal, then prepare it using the appropriate process before plating.
Plating is slow (tank plating)
 Gold Strike plates more slowly than gold plating solutions Plating is proceeding normally, with steady gassing at the workpiece. This is normal: Gold Strike is designed to give excellent adhesion, not speed, and much of the electricity produces gas rather than gold. Use Gold Strike for a thin adhesion layer only, then build up the gold thickness with Gold Tank Plating Solution. Check the expected plating time with the Gold Strike Calculator.
Gold content of the solution is depleted The solution has been used repeatedly and the plating rate has gradually become slower. Gold Strike contains only 2 g/L of gold. Replace with fresh Gold Strike.
Amps set too low Plating is even but slow. The surface area may have been overestimated, or the amps set for a lower plating factor than recommended. Check the surface area and use the Gold Strike Calculator to find the correct amp setting. The recommended plating factor is 0.03 A/cm².
Solution is too cold Plating is slower than usual even though the solution and electrical contact are otherwise satisfactory. Allow the solution to reach the operating temperature range of 18–40 °C. The plating rate increases with temperature.
High resistance in an electrical connection Plating is unusually slow despite otherwise normal conditions. A poor or partially oxidised connection may become noticeably warm or hot to the touch. Switch off the power and check all electrical connections. Clean or replace any oxidised, loose or damaged contacts before continuing.
Plating is patchy or uneven (tank plating)
 Insufficient activation of the surface Gold plates readily on some areas but is reluctant to start, or fails to plate, on others. This is most common on chrome and surgical stainless steel. Rub the surface with MPU immediately before plating, rinse, and plate without allowing the surface to dry. For passive stainless steel, Stainless Steel Activator for Tank Plating can also be used.
Surface not properly cleaned Plating is patchy or refuses to deposit in some areas. Oil, grease or other contamination remaining on the surface interferes with plating. Improve the cleaning process, introducing a degreasing stage where necessary.
Chrome worn through or damaged On older chrome-plated articles, worn areas may expose the nickel, copper or brass underneath. The gold looks different over these areas, or later develops speckles. Inspect the surface carefully before plating. We strongly advise against using Gold Strike on copper or its alloys. Where copper or brass is exposed, apply a barrier layer of nickel, silver or palladium first – see the Process Sequences tab.
Clear coat, lacquer or E-coating only partially removed Gold plates on exposed areas but not where the insulating coating remains, producing sharply defined or irregular patchy plating. Completely remove all remaining coating, then prepare the exposed metal before replating.
Deposit is grey-brown (tank plating)
 Iron contamination The gold deposit has a grey-brown appearance. A stainless steel electrode is being used. Stop using the stainless steel electrode and discard the contaminated solution. Use a Platinum Rod Electrode for Beaker Plating, preferably fitted with an Anode Bag to reduce the amount of gas in the solution. We strongly advise against using a stainless steel electrode for Gold Strike tank plating.
Plating fails the adhesive tape test or peels (tank plating)
 Surface not properly activated, or allowed to dry after activation Gold plates but fails the adhesive tape test or subsequently peels. This is particularly common on chrome and stainless steel if the surface is allowed to dry after preparation. Rub the surface with MPU immediately before plating. After preparation, rinse as required but do not allow the work to dry before plating.
Gold Strike layer is too thick on a difficult-to-plate surface Gold Strike has been plated well beyond approximately 0.1 µm on chrome or surgical stainless steel. As the deposit becomes thicker, internal stress can cause it to fail the tape test or peel. Keep the Gold Strike layer to approximately 0.1 µm on chrome and surgical stainless steel. Build any further thickness with Gold Tank Plating Solution.
Next gold layer peels away from the Gold Strike The Gold Strike layer itself is sound, but the gold plated on top of it separates. The work may have been allowed to dry, or been handled or contaminated, between the two stages. After Gold Strike, rinse and go straight to the next gold plating stage without allowing the work to dry. If the work has dried, lightly rub it with MPU, rinse and continue.
Existing plating or coating is poorly adhered Examine the underside of the material removed by the tape. A gold-coloured underside indicates failure at the gold interface, while a silver, chrome or copper-coloured underside indicates that an underlying plated layer has failed. There may already be signs of blistering, flaking or delamination before gold plating. Remove all loose or poorly adhered plating back to a sound surface before replating. A new gold layer cannot improve the adhesion of an unstable coating underneath it.
Plating onto a PVD coating Gold may initially appear to plate normally, but fails the tape test or subsequently peels. Remove the PVD coating completely, then prepare and plate the underlying surface.
Gold Strike used on copper, brass, bronze or another copper alloy The article is copper or a copper alloy, or copper or brass has been exposed underneath worn plating. Gold Strike Brush and Tank is not suitable for these metals. We strongly advise against using Gold Strike on copper or its alloys. Apply a barrier layer of nickel, silver or palladium, then plate with Gold Tank Plating Solution – see the Process Sequences tab.
Plating is dull (tank plating)
 Underlying surface is dull The gold deposit is sound and uniform, but has approximately the same surface finish as the surface underneath. Gold Strike will retain the brightness of the underlying surface, but it will not level it. Polish the surface to the required finish before plating. If it has already been plated, carefully polish the gold using the appropriate grade of MPU and replate if necessary.
Deposit colour is wrong (tank plating)
 Gold Strike layer is very thin The gold looks pale, greyish or uneven in colour because the underlying chrome or stainless steel is still showing through the thin gold. Continue plating to approximately 0.1 µm, or follow the Gold Strike with Gold Tank Plating Solution to develop the full gold colour.
Solution contaminated with another metal The gold plates normally but develops an unexpected colour. Contamination can come from a workpiece not properly rinsed between processes. For example, copper contamination can give a reddish hue. Rinse the workpiece thoroughly between each process. If the Gold Strike has become significantly contaminated, replace it.
Incorrect electrode material The deposit develops an abnormal colour during plating. A copper electrode can produce a reddish deposit, while a nickel electrode can give a noticeably paler colour. Use a Platinum Rod Electrode for Beaker Plating, preferably fitted with an Anode Bag. If the solution has become significantly contaminated, replace it before continuing.
Incorrect plating thickness (tank plating)
 Incorrect plating area estimated or calculated This is the most common cause of incorrect plating thickness. It is particularly easy to underestimate irregular shapes, edges, recesses or multiple surfaces. Estimate the total area as accurately as possible and repeat the calculation using the corrected area. If you are unsure how to estimate the surface area of your workpiece, ask our Technical Assistant for help.
Thickness estimated from appearance The gold appears to have fully covered the surface, but measurement shows the deposit is thinner or thicker than required. Appearance alone is not a reliable guide to thickness once full coverage has been obtained. Use the Gold Strike Calculator to work out the plating time rather than judging thickness by appearance.
Plating conditions differ from those assumed by the calculator The calculated plating time has been followed but the measured thickness is consistently high or low. Temperature, agitation and electrical contact all affect the actual plating rate. For work where thickness is important, measure the result by XRF or by weighing the article before and after plating, and use the measured result to adjust plating times under your working conditions.

 

Brush plating

Fault

Possible cause

Diagnostic clue

Corrective action
No plating at all (brush plating)
 Open circuit If you are using a MultiPlater, an open circuit is indicated by a continuous red light. A conventional power supply will show zero amps. Check the workpiece connection, electrode and leads. Make sure the swab is fully wetted with plating solution so that electrical contact is maintained. If you are unsure whether the surface itself is electrically conductive, check it with the Conductivity Tester before continuing.
Connections reversed The MultiPlater will still show a green light and a conventional power supply will still show amps, but no gold deposits. Correct the polarity: workpiece negative (–), electrode positive (+). Chrome and stainless steel will usually only need to be reactivated.
Swab not fully wetted with plating solution No current flows if the plating solution does not make contact between the electrode and the workpiece. Make sure the swab is fully wetted with Gold Strike.
Trying to plate directly onto a PVD coating Gold Strike plates directly onto chrome, but PVD coatings are often mistaken for chrome or gold plate. Little or no gold may deposit. Irregular swirling or streaked marks can appear across the surface, rather like skate marks on an ice rink. The swab may also become dark or gold-coloured as tiny particles of the PVD coating detach and collect on it. We advise against brush plating directly onto the PVD coating. Remove the PVD coating completely, then prepare and plate the underlying surface.
Existing clear coat, lacquer or E-coating on the surface A continuous clear insulating coating prevents electrical contact with the underlying metal, so no gold plates. With a MultiPlater, the indicator remains red because no current is flowing. The coating can be difficult to see and the underlying surface may still look metallic. Completely remove the coating to expose the underlying metal, then prepare it using the appropriate process before plating.
Platinum coating on the electrode completely worn away If you are using a MultiPlater, a continuous red light will show. A conventional power supply will show zero amps even though the electrical connections are sound. Replace the worn electrode, or use a Carbon Electrode.
Plating is slow (brush plating)
 Gold Strike plates more slowly than gold plating solutions Plating is proceeding normally, with some gassing under the swab. This is normal: Gold Strike is designed to give excellent adhesion, not speed. Use Gold Strike for a thin adhesion layer only, then build up the gold thickness with Gold Brush Plating Solution. Check the expected plating time with the Gold Strike Calculator.
Gold content of the solution is depleted The solution has been used repeatedly and the plating rate has gradually become slower. Gold Strike contains only 2 g/L of gold, so a small volume of solution is used up relatively quickly. Replace with fresh Gold Strike. The Gold Strike Calculator shows the volume of solution needed for the job.
Voltage too low There is full electrical contact and plating is taking place, but the deposition rate is slower than expected. Increase the voltage gradually within the recommended operating range of 3–4 V.
Swab not fully wetted, too small, or not kept in consistent contact Plating takes place, but the overall build-up is slower than expected. Keep the swab fully wetted and in consistent contact with the surface while moving it continuously. Use a larger swab where practical and select it in the Gold Strike Calculator.
Solution or workpiece is too cold Plating is slower than usual even though the solution, swab and electrical contact are otherwise satisfactory. Allow the solution and workpiece to reach the operating temperature range of 18–40 °C before plating.
High resistance in an electrical connection Plating is unusually slow despite otherwise normal conditions. A poor or partially oxidised connection may become noticeably warm or hot to the touch. Switch off the power and check all electrical connections. Clean or replace any oxidised, loose or damaged contacts before continuing.
Plating is patchy or uneven (brush plating)
 Insufficient activation of the surface Gold plates readily on some areas but is reluctant to start, or fails to plate, on others. This is most common on chrome and surgical stainless steel. Rub the surface with MPU immediately before plating, rinse, and plate without allowing the surface to dry. For passive stainless steel, Stainless Steel Activator for Brush Plating can also be used.
Surface not properly cleaned Plating is patchy or refuses to deposit in some areas. Oil, grease or other contamination remaining on the surface interferes with plating and is transferred to the swab. Improve the cleaning process, introducing a degreasing stage where necessary. The contaminated swab must be washed thoroughly with concentrated detergent and rinsed very well with clean water before being used again.
Chrome worn through or damaged On older chrome-plated articles, worn areas may expose the nickel, copper or brass underneath. The gold looks different over these areas, or later develops speckles. Inspect the surface carefully before plating. We strongly advise against using Gold Strike on copper or its alloys. Where copper or brass is exposed, apply a barrier layer of nickel, silver or palladium first – see the Process Sequences tab.
Clear coat, lacquer or E-coating only partially removed Gold plates on exposed areas but not where the insulating coating remains, producing sharply defined or irregular patchy plating. Completely remove all remaining coating, then prepare the exposed metal before replating.
Swab contaminated from a previous process The swab is discoloured, indicating that it has retained foreign material from an earlier process. Wash the swab thoroughly with concentrated detergent and rinse very well with clean water. Replace the swab if the contamination cannot be removed.
Residual brighteners or other strongly adherent residues from previous tank plating The surface has recently been tank plated, particularly with silver, and the Gold Strike deposits unevenly or refuses to plate properly in some areas. Thoroughly remove residual plating additives before plating. Where practical, rub the surface with MPU before proceeding. Freshly tank-plated silver can retain strongly adherent sulphide brighteners which can seriously interfere with subsequent plating. We strongly advise against using Gold Strike on copper or its alloys; apply a suitable barrier layer first.
Deposit is grey-brown (brush plating)
 Iron contamination The gold deposit has a grey-brown appearance. A stainless steel electrode is being used. Stop using the stainless steel electrode and discard the contaminated solution. Use a Carbon Electrode or Platinum Electrode.
Plating fails the adhesive tape test or peels (brush plating)
 Surface not properly activated, or allowed to dry after activation Gold plates but fails the adhesive tape test or subsequently peels. This is particularly common on chrome and stainless steel if the surface is allowed to dry after preparation. Rub the surface with MPU immediately before plating. After preparation, rinse as required but do not allow the work to dry before plating.
Gold Strike layer is too thick on a difficult-to-plate surface Gold Strike has been plated well beyond approximately 0.1 µm on chrome or surgical stainless steel. As the deposit becomes thicker, internal stress can cause it to fail the tape test or peel. Keep the Gold Strike layer to approximately 0.1 µm on chrome and surgical stainless steel. Build any further thickness with Gold Brush Plating Solution.
Next gold layer peels away from the Gold Strike The Gold Strike layer itself is sound, but the gold plated on top of it separates. The work may have been allowed to dry, or been handled or contaminated, between the two stages. After Gold Strike, rinse and go straight to the next gold plating stage without allowing the work to dry. If the work has dried, lightly rub it with MPU, rinse and continue.
Existing plating or coating is poorly adhered Examine the underside of the material removed by the tape. A gold-coloured underside indicates failure at the gold interface, while a silver, chrome or copper-coloured underside indicates that an underlying plated layer has failed. There may already be signs of blistering, flaking or delamination before gold plating. Remove all loose or poorly adhered plating back to a sound surface before replating. A new gold layer cannot improve the adhesion of an unstable coating underneath it.
Plating onto a PVD coating Gold may initially appear to plate normally, but fails the tape test or subsequently peels. Remove the PVD coating completely, then prepare and plate the underlying surface.
Immersion deposit from contaminated process solution A very thin, sometimes virtually invisible, layer of another metal — most commonly copper — forms on the surface before plating. The gold may initially appear satisfactory but fails the adhesive tape test or subsequently peels because it is adhering to the poorly adherent immersion deposit rather than directly to the prepared surface. Copper contamination is particularly common when activators or cleaners have previously been used with copper or copper alloys. Replace the contaminated activator or cleaner, then prepare and reactivate the work before replating. Good housekeeping: do not process ferrous and non-ferrous metals in the same acidic activator, and replace cleaning solutions regularly. Avoid cathodic cleaning in cleaner that has previously been used with copper or copper alloys, particularly tarnished copper alloys.
Gold Strike used on copper, brass, bronze or another copper alloy The article is copper or a copper alloy, or copper or brass has been exposed underneath worn plating. Gold Strike Brush and Tank is not suitable for these metals. We strongly advise against using Gold Strike on copper or its alloys. Apply a barrier layer of nickel, silver or palladium, then plate with Gold Brush Plating Solution – see the Process Sequences tab.
Plating is dull (brush plating)
 Underlying surface is dull The gold deposit is sound and uniform, but has approximately the same surface finish as the surface underneath. Gold Strike will retain the brightness of the underlying surface, but it will not level it. Polish the surface to the required finish before plating. If it has already been plated, carefully polish the gold using the appropriate grade of MPU and replate if necessary.
Deposit colour is wrong (brush plating)
 Gold Strike layer is very thin The gold looks pale, greyish or uneven in colour because the underlying chrome or stainless steel is still showing through the thin gold. Continue plating to approximately 0.1 µm, or follow the Gold Strike with Gold Brush Plating Solution to develop the full gold colour.
Solution contaminated with another metal The gold plates normally but develops an unexpected colour. Contamination can come from a swab previously used with another plating solution and not thoroughly washed, or from a workpiece not properly rinsed between processes. For example, copper contamination can give a reddish hue. Prevent carry-over between processes. Thoroughly wash swabs with concentrated detergent and rinse very well with clean water before using them with another solution. Rinse the workpiece thoroughly between each process. If the Gold Strike has become significantly contaminated, replace it.
Incorrect electrode material The deposit develops an abnormal colour during plating. A copper electrode can produce a reddish deposit, while a nickel electrode can give a noticeably paler colour. Use a Carbon Electrode or Platinum Electrode. If the solution has become significantly contaminated, replace it before continuing.
Poor coverage (brush plating)
 Swab not fully wetted with plating solution Gold plates where good solution contact is made but fails or becomes weak elsewhere. The swab may look wet externally while not being fully saturated around the electrode. Fully saturate the swab with Gold Strike and keep it adequately wetted throughout plating.
Intermittent electrical contact Plating repeatedly starts and stops as the swab moves across the work. With a MultiPlater, the warning beep sounds and the indicator flashes between green and red as electrical contact is lost and restored. Check the workpiece connection and maintain continuous contact between the wetted swab and the workpiece while plating.
Swab too small for the area being plated Individual areas plate normally, but obtaining uniform coverage over the complete area is difficult or excessively slow. Use a larger swab appropriate to the area being plated. Use the Gold Strike Calculator to select the appropriate swab and estimate the plating time.
Scratchy plating (brush plating)
 Particulate contamination of the swab Fine scratches appear as the swab passes over the surface, particularly where retained particles are harder than the metal being plated. Replace the swab. Do not continue plating with a swab containing particulate contamination.
Swab stored alongside abrasives Scratching starts immediately with an otherwise apparently clean swab. Replace the swab and store plating swabs separately from abrasives, polishing compounds and other sources of particulate contamination.
Old silver-plating swab contains metallic silver particles An old silver swab has darkened or been exposed to light before being thoroughly washed, allowing retained silver compounds to be photoreduced to metallic silver particles. Replace the swab. Do not try to recover a swab once metallic silver particles are trapped in it.
Incorrect plating thickness (brush plating)
 Incorrect plating area estimated or calculated This is the most common cause of incorrect plating thickness. It is particularly easy to underestimate irregular shapes, edges, recesses or multiple surfaces. Estimate the total area as accurately as possible and repeat the calculation using the corrected area. If you are unsure how to estimate the surface area of your workpiece, ask our Technical Assistant for help.
Thickness estimated from appearance The gold appears to have fully covered the surface, but measurement shows the deposit is thinner or thicker than required. Appearance alone is not a reliable guide to thickness once full coverage has been obtained. Use the Gold Strike Calculator to work out the plating time rather than judging thickness by appearance.
Plating conditions differ from those assumed by the calculator The calculated plating time has been followed but the measured thickness is consistently high or low. Swab movement, electrical contact, voltage and temperature all affect the actual plating rate. For work where thickness is important, measure the result by XRF or by weighing the article before and after plating, and use the measured result to adjust plating times under your working conditions.

 

Preparing the surface for electroplating - creating a water break-free surface

Good surface preparation is one of the most important steps in successful electroplating. In fact, many plating problems occur because the metal surface hasn't been cleaned or prepared properly.

Before you start plating, your aim is to achieve a water break-free surface. This gives your plating solution the best possible chance of producing a sound, well-adhered finish.

The following guidance applies to pen, brush and tank electroplating.

What Is a Water Break-Free Surface?

A water break-free surface is a metal surface that’s completely clean and free from grease, oil and other contamination.

You can check this by holding your item under gently running water.

If the water flows evenly across the surface without forming droplets or pulling away into patches, you’ve achieved a water break-free surface.

However, if the water gathers into droplets or breaks apart, contamination may still be present. You’ll need to repeat the cleaning process before plating.

The photograph of the copper sheet above shows the difference.

On the top half of the copper sheet, contamination causes the water to gather into droplets.

On the bottom half, the water drains away evenly because the surface is clean. This is the water break-free finish you’re aiming for.

Water-break-free

Step 1: Make Sure Your Metal Has the Finish You Want

Before cleaning, check that your item has the surface finish you want to achieve.

Electroplating follows the contours of the underlying metal. Therefore, it won’t hide scratches or turn a matt surface into a highly polished one.

If your item needs polishing, complete this first.

If your work needs a lot of polishing and surface finishing you will need to make sure all of the residue from these processes are completely removed before attempting to electroplate.

For more information, see our guide to Hand and Machine Polishing Metal for Electroplating.

machine polishing

Step 2: Removing Polishing Compounds, Grease and Dirt

If you’ve polished your item with Autosol or used a polishing machine, you’ll need to remove any remaining polishing compounds.

Start by cleaning the surface with a suitable solvent or our MetaPrep.

Next, use liquid detergent to remove any remaining solvent or MetaPrep.

Finally, rinse thoroughly under running water until you’ve removed all traces of detergent.

This initial cleaning stage prepares your item for the final cleaning and activation process.

Step 3: Clean and Activate the Surface

Cleaning removes dirt, grease and oil. Activation removes the oxide layer that can form on metal surfaces.

Some metals, particularly stainless steel, nickel and nickel-containing alloys such as nickel silver, need special attention because of their oxide layers.

Spa Plating offers several ways to clean and activate your work. The best method depends on the metal you’re plating, its size and its surface condition.

For Small and Medium-Sized Items

If your item has a fairly smooth surface and isn’t made from stainless steel, nickel or a nickel-containing alloy, we recommend MPU (MetaPrep Ultra).

MPU removes remaining traces of oil while activating the metal surface at the same time.

Apply it using tissue paper, making sure you treat the whole surface.

For Stainless Steel, Nickel and More Difficult Surfaces

If you’re preparing stainless steel, nickel or nickel-containing alloys, we recommend our ActiClean.

ActiClean cleans and activates the surface in one process.

It’s also a useful choice for very large items or those with uneven surfaces.

For this process, use a Carbon Electrode, preferably, or a Platinum Electrode.

For Tank Plating and Items with Recesses

If you’re preparing items for tank plating, you can use our powered Cleaning Beaker together with our Cleaner. You can use our in-house designed and manufactured MultiPlater to power this stage.

This powered immersion method is particularly useful for items with rough surfaces or recesses.

For example, some surfaces may catch on a cleaning swab, while recessed areas can trap traces of MPU. The Cleaning Beaker provides an alternative way to prepare these items.

Step 4: Check for a Water Break-Free Surface

Once you’ve completed the cleaning and activation process, it’s time for the final check.

Hold your item under gently running water and watch how the water behaves.

If it flows evenly across the surface without forming droplets or breaking apart, your item has passed the water break-free test.

However, if the water gathers into droplets or pulls away from certain areas, repeat the appropriate cleaning steps.

Don’t start plating until you’ve achieved a water break-free surface.

Ready to Start Plating?

Once you’ve achieved a water break-free surface, you’re ready to move on to the appropriate plating process for your metal.

Remember, taking a little extra care during surface preparation can make a considerable difference to your final plating result.

Gold Strike Brush and Tank – Process Sequences

Gold Strike Brush and Tank can be used for both tank plating and brush plating. Tank plating processes are given first and brush plating processes below. Use the Gold Strike Calculator to work out plating times, amp settings and the volume of solution required.

Gold Strike can plate directly on to chrome. However, plating directly on to chrome does not give the best adhesion. For best adhesion, we recommend stripping the chrome back to the nickel underneath before gold plating. Only plate directly on to chrome where stripping isn’t practical, for example with on-site work or fittings that can’t be removed.

We strongly advise against using Gold Strike on copper, brass, bronze or any other copper alloy. Plate these with a barrier layer of nickel, silver or palladium first, then follow the sequence for that metal below.

Tank plating

Plating Gold Strike on chrome

  • Prepare the surface (see the Surface Preparation tab)
  • Rinse
  • Plate a thin adhesion layer of Gold Strike using the conditions recommended by the Gold Strike Calculator
  • Rinse (do not allow to dry)
  • If a thicker gold layer is needed, plate with Gold Tank Plating Solution using the conditions recommended by the Gold Tank Plating Calculator
  • Rinse and dry

Plating Gold Strike on stainless steel and difficult-to-plate metals such as surgical instruments, dental alloys, tungsten and Inconel

  • Prepare the surface (see the Surface Preparation tab)
  • Rinse
  • Plate a thin adhesion layer of Gold Strike using the conditions recommended by the Gold Strike Calculator
  • Rinse (do not allow to dry)
  • If a thicker gold layer is needed, plate with Gold Tank Plating Solution using the conditions recommended by the Gold Tank Plating Calculator
  • Rinse and dry

Plating Gold Strike on nickel and its alloys (such as nickel silver and Monel), including chrome stripped back to nickel

  • Prepare the surface (see the Surface Preparation tab)
  • Rinse
  • Plate a thin adhesion layer of Gold Strike using the conditions recommended by the Gold Strike Calculator
  • Rinse (do not allow to dry)
  • If a thicker gold layer is needed, plate with Gold Tank Plating Solution using the conditions recommended by the Gold Tank Plating Calculator
  • Rinse and dry

Brush plating

Brush plating Gold Strike on to chrome

  • Prepare the surface (see the Surface Preparation tab)
  • Rinse
  • Brush plate a thin adhesion layer of Gold Strike using the conditions recommended by the Gold Strike Calculator
  • Rinse (do not allow to dry)
  • If a thicker gold layer is needed, brush plate with Gold Brush Plating Solution using the conditions recommended by the Gold Brush Plating Calculator
  • Rinse and dry

Brush plating Gold Strike on to stainless steel and difficult-to-plate metals such as surgical instruments, dental alloys, tungsten and Inconel

  • Prepare the surface (see the Surface Preparation tab)
  • Rinse
  • Brush plate a thin adhesion layer of Gold Strike using the conditions recommended by the Gold Strike Calculator
  • Rinse (do not allow to dry)
  • If a thicker gold layer is needed, brush plate with Gold Brush Plating Solution using the conditions recommended by the Gold Brush Plating Calculator
  • Rinse and dry

Brush plating Gold Strike on to nickel and its alloys (such as nickel silver and Monel), including chrome stripped back to nickel

  • Prepare the surface (see the Surface Preparation tab)
  • Rinse
  • Brush plate a thin adhesion layer of Gold Strike using the conditions recommended by the Gold Strike Calculator
  • Rinse (do not allow to dry)
  • If a thicker gold layer is needed, brush plate with Gold Brush Plating Solution using the conditions recommended by the Gold Brush Plating Calculator
  • Rinse and dry

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