Gold Tank Plating Solution

Price range: £170.55 through £5,572.87 + VAT

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Our Gold Tank Plating Solution contains 4 grams of gold per litre. It is made specifically for tank plating and gives consistently bright results.

This tank plating solution is ready to use straight out of the bottle – no pre-mixing required.

Why choose Spa Plating?

We  save you time and money because…

  • Our plating solutions have been fully tested for optimum efficiency and ease of use.
  • We have developed unique equipment such as our power source, the MultiPlater and processes that get the best out of every product we sell
  • Our Plating Calculators take the guess work out of achieving top quality plating results for the minimum time and cost
  • We provide free online technical support via our YouTube channel and on each product page under the Blue Tabbed Panel.

HS Code: 3824 99 70

Because our Gold Plating Solution for tank plating contains 4g of gold per litre, it is very flexible and can be used to gold plate on sterling silver to vermeil standard (a gold thickness of 2.5 microns) as well as plating thin, decorative gilding layers of 0.1 – 0.2 microns.

All you have to do is enter in the surface area of the item you want to plate and the thickness of plate you require into our Plating Calculator. This will work out the plating times for whatever thicknesses you need.

The ring in the photo has a surface area of 8cm squared and took 14 minutes to plate to a thickness of 2.5 microns. If only a layer of 0.1 microns was required then the ring would have only needed 33 seconds immersion in a 250ml tank.

Once you have used your gold plating solution to plate to particular thicknesses you will need to check you have enough gold left in your solution. You can use our Gold Tank Replenisher to keep the concentration of gold in your solution topped up. Here is a link to our Gold Tank Concentration Calculator that will help with replenishing your gold.

Here is a typical set up for gold tank plating using Spa Plating’s equipment and solution. For more guidance on how to use our tank plating solutions and equipment, please see our YouTube channel and visiting our Gold Tank Plating Calculator to work out how much plating solution you’ll need.

This video shows our gold tank plating solution being used to gold tank plate to vermeil standard using our gold tank plating kit;

 

Back to Product Description
Features Benefits
Formulated specifically for tank plating Plates consistently bright over a range of operating conditions
Designed to be used with our online Gold Tank Plating Calculator You know in advance not only how much gold you’ll be plating but also how much gold will be left in the gold solution.

 

Gold tank plating a silver ring to vermeil standard

Our Gold Tank Plating Kit, when used with our on-line Gold Tank Plating Calculator, means you’re now in complete control of the gold plating process.
Plating to vermeil standard requires a layer of gold of at least 2.5 microns on sterling silver and our kit will help you plate to these kinds of specific and substantial thicknesses of gold.
You’ll not only be confident that the layer of gold you’ve plated is of a uniform thickness, you’ll also know how much gold is left in your remaining plating solution and therefore how long it will take to plate your next item to the same or a different specification.
Our kit also offers you the flexibility of plating larger objects in our 500ml, 1 and 2 litre capacity Plating Beakers.

1. Arranging your kit

Set up your Gold Tank Plating Kit as shown.

Below is a video showing you how to set up the power source for this kit, the Microplater Classic.

2. Setting up the gold plating beaker

Once the plating beaker is filled with gold solution and is on the hot plate stirrer, grip one of the red leads to its mesh electrode.

Turn on the Electronic Stirrer and place the magnetic stirrer bar in the gold plating solution. Set the hot plate stirrer bar speed to 1 and the heat setting to between 0 and 1. You are aiming to heat the gold plating solution to 25 to 30 degrees centigrade, so you will need to adjust these settings as you go, to maintain a constant temperature. Check the temperature of the solution with the Temperature Probe.

3. Setting up the cleaner beaker

The other red lead should grip on to the mesh electrode in the cleaner beaker.

4. Connecting the Plating Stand

The black lead should be plugged in to the base of the Plating Stand.

5. Connecting to the power source

The other ends of the red and black leads should be plugged in to the MF Rectifier.

6. Calculating plating and powered cleaning times

You’ll need to work out the surface area you’re plating and decide the thickness of plate you require.

In this case we’ll be plating gold onto a sterling silver ring to vermeil standard. This means we’ll be plating to a gold thickness of 2.5 microns. The surface area of the example ring worked out at 8 square centimetres.

Go to the Gold Tank Plating Calculator on the Gold Tank Plating Kit shop page and enter in the required data. Press the ‘Calculate’ button and take a note of the results.

Based on the above data, the amp setting on the MF Rectifier for gold plating will be 0.08 for just over 22.09 minutes.

Set the Economy Rectifier to 3 volts for cleaning.

7. Preparing the surface of the ring for plating with MPU

First clean the ring with MPU using a soft tissue. Then make a small jig to hold the ring, using the Gold Plated Jigging Wire and the Wire Cutters.

8. Preparing the surface of the ring for plating with the Ultrasonic Cleaner

Hang the ring on its wire jig in the Ultrasonic Cleaner and turn it on – a couple of minutes should be enough.

8. 1st and 2nd of the 6 rinse stages

Briefly dip the ring into the first and second of the six rinse stages. The water you use can be ordinary tap water for 5 out of 6 of the rinse stages; we recommend for the last 6th stage that you use deionised

9. Powered cleaning 0.8 amps

The Gold Tank Plating Calculator has told us that the amp setting for the gold plating stage should be 0.08 amps. For the Cleaner stage, the amps on the MF Rectifier should now be set to 0.8

Leave the ring in the Cleaner for 2-5 minutes. Once it’s done, take the ring out of the Cleaner and pass it through rinse three and four of the six rinse stages.

10. Gold tank plating

Adjust the rectifier so that the amp reading is 0.08

Grip the wire jig (with the ring hanging from it) in the crocodile clip that’s fixed to the arm of the plating stand.

Make sure the Plating Timer is set to the right time (in this case 14.04 minutes) and start the timer as soon as you lower the ring into the plating solution.

11. Final rinse stages

After the plating has finished, take the ring out of the plating solution and pass it through the two remaining rinses.

We recommend that the last rinse should be deionised water.

12. Finishing with MetaSeal

The gold plated ring can now be finished with MetaSeal to bring out the lustre of the plate and help seal its surface.

14. Maintaining your tank plating solution

To maintan the plating solution in best working order, cover the beaker with cling film between uses. This will prevent dust and fine hairs getting in and reducing the eficiency of the solution. If you’re not going to be using the solution for more than three consequetive days it is best to re-bottle it.

At some point it’s also a good idea to filter your solution. Guidance on this can be found on the filter kit product page HERE.

Gold Tank Calculator

How to use this calculator :

1. In the first box, enter the thickness that you want to plate to in microns (thousandths of a millimetre).

2. In the second box, enter the surface area of the article in square centimetres (cm2).

3. In the third box, enter the gold concentration (for a new solution that’s 4 grams per litre).

4. In the fourth box, enter the speed at which you want the gold to plate (microns per minute).

5. In the fifth box, ender the volume of solution purchased (ml).

6. Click the ‘Calculate’ button.

7. Read off the amp setting for your rectifier and the plating time.

8. Amp-hours (Ah) and Coulombs are quoted in the next two boxes. These should be used if you’re monitoring the process with the MicroPlater (in Amp-hour mode) or using our Coulometer.

9. Temperature and agitation are quoted in the following two boxes.

10. The concentration of gold remaining and the volume of replenisher to add is shown in the next two boxes.

11. The cost of solution used and weight of gold are shown in the final two boxes.

Operating Conditions and Deposit Data

Plating Factor 0.01 A/cm2 (see notes)
Plating rate 0.15 micron per minute at 0.01A/cm2, 20°C and
low agitation ( see notes)
Maximum plating thickness 4 microns
Temperature 18 – 40 °C (see notes)
pH 4.3 – 4.5
Gold concentration 4 grams per litre
Turnovers to exhaustion 20 – 24 grams of gold added per litre
Agitation Low to vigorous (see notes)
Electrode Platinum Rod Electrode (preferably bagged)
Gold content in plate 99.9% (balance carbon)
Cathode efficiency ~25% at Plating Factor = 0.01A/cm2
Hardness 190 – 210 Hv
Density of deposit 19.3 g/cm3
Stress Medium
Special storage requirements Away from sunlight
Shelf life 1 year
Health and Safety classification Harmful
Special considerations Contains potassium cyanide (0.15%)
Transport (UN number) None: Not classified as dangerous for transport

Notes:

  • Recommended plating factor range is between 0.008 and 0.012 A/cm2
  • The plating rate varies considerably with temperature and agitation at any
    fixed plating factor.
  • The only gold that should be replenished is via Gold Tank Replenisher; the amount to add should be calculated using our online calculator.
  • Evaporation losses are made up usually at the end of the day by topping back up to the original level with deionised water.
  • Rinse articles above the solution when you remove them from the tank so all the gold solution left over on the work goes back into the tank and is not wasted. If not, the gold will be dragged out and wasted.
  • One litre of gold solution should last between 5 and 6 turnovers. That means that a gold solution which has 4 grams per litre of gold in it as supplied should plate out at least 5 x 4 = 20 grams of gold before it becomes overloaded with potassium and starts to crystallise out as potassium salts.

General guide;

Certain small items, for example Swabs, Nibs and Plating Pens can be sent by normal post within the UK

  • The courier option for UK deliveries is FedeX and APC. Delivery times range usually from 2 – 5 working days.
  • Royal Mail option is available on a limited range of non-liquid orders. Delivery from 5 – 10 working days.
  • Free UK mainland delivery available on orders over £200
  • International orders usually 5 – 10 working days.

For all price quotations for deliveries, please add your items to our shopping cart. You will be able to see the shipping costs by clicking on the ‘Calculate shipping’ button in the cart and before checking out.

Please click on the link below to download the SDS for this product:

https://goldn.co.uk/msds/gold_tank_plating_solution.pdf

Fault

Possible cause

Diagnostic clue

Corrective action
No plating at all
 Open circuit / electricity not flowing MultiPlater: the red light remains on, indicating that no current is flowing. A third-party power supply shows zero amps. Check all electrical connections and contact points. Clean the contact points if necessary.
Reverse polarity Current may still flow, but gold does not deposit. The workpiece may show signs of anodic attack. Correct the polarity: workpiece negative (–), platinum rod electrode positive (+).
Plating is dull or matt
 Plating onto a porous or poorly finished surface The gold deposit is sound but reproduces the dull, porous, scratched or uneven finish of the underlying surface. Polish or otherwise prepare the article to the required finish before repeating the surface preparation and plating.
Gold concentration has become depleted through use A previously satisfactory solution gradually gives a duller or weaker-looking deposit as gold is removed from the solution. Check the amount of gold plated from the solution and replenish only in accordance with the Gold Tank Plating Solution instructions. Do not make unapproved chemical additions.
Temperature too high The deposit becomes dull or matt when the solution is being operated above its recommended temperature range. Allow the solution to return to the recommended operating temperature before continuing.
Low conductivity / excessive voltage required The required amps can only be obtained at an unusually high voltage. On the MultiPlater, the operating indication may show that excessive voltage is being required. Check electrical contacts, solution level, electrode position and the condition of the platinum rod electrode. Do not attempt to alter the solution chemistry.
Organic contamination The deposit remains dull or matt despite the normal operating conditions being correct. Treat the plating solution with Carbon Powder in accordance with Spa Plating’s instructions to remove organic contamination.
Burnt deposit, especially on corners and edges
 Amps too high The deposit becomes dark, burnt or powdery, usually first on corners, edges and other high-current areas. Check the surface area and use the Gold Tank Plating Calculator to determine the correct amp setting. Reduce the amps if necessary.
Article too close to the electrode Burning is localised on the area closest to or directly facing the platinum rod electrode. Increase the distance between the article and electrode or reposition them to obtain a more even current distribution.
Gold concentration too high Burning occurs despite otherwise suitable operating conditions, particularly after excessive replenisher additions. Reduce the amps in approximately 10% increments until the burning disappears. Do not add further replenisher until the excess gold has been plated out sufficiently for the normal amp setting to be restored.
Too little agitation Burning or darkening is concentrated in high-current areas and solution movement around the workpiece is poor. Increase agitation to the recommended level and make sure there is good solution movement around the whole article.
Temperature too low Burning occurs when the solution is below its recommended operating temperature. Raise the solution to the recommended operating temperature before continuing.
Incorrect plating thickness
 Incorrect surface area estimated or calculated The measured thickness differs from the target even though the calculated amp setting and plating time were used. Irregular shapes, edges, recesses and multiple surfaces are easily underestimated. Recheck the total surface area in cm² and enter the corrected area and required thickness into the Gold Tank Plating Calculator. If you are unsure how to estimate the surface area, ask our Technical Assistant for help.
Temperature differs from that used for the calculation The calculated amp setting and plating time have been followed, but the measured thickness is consistently higher or lower than expected. Check the actual solution temperature and use the Gold Tank Plating Calculator with the appropriate temperature setting.
Agitation differs from that used for the calculation The calculated plating time has been followed, but the measured thickness differs from the target. Check that the actual agitation corresponds with the setting used in the Gold Tank Plating Calculator.
Deposit is bright but rough
 Particulate contamination of the plating solution The deposit retains its normal bright gold appearance but develops a rough or gritty surface. A common source is abrasive residue carried into the solution from the workpiece, particularly material trapped in holes, recesses and relief work. Dust from buffing and polishing machines is another major source of particulate contamination. Thoroughly rinse and inspect workpieces after polishing or abrasive preparation, paying particular attention to holes, recesses and relief work. Keep the plating area and solution protected from buffing and polishing dust. If contamination has entered the solution, filter it through suitable filter paper or use continuous cartridge filtration.
Deposit is pitted
 Gas bubbles reaching or adhering to the workpiece Small pits or pinholes appear where gas bubbles have contacted or remained on the surface. Gas is generated at both electrodes, with a substantial proportion generated at the anode. Excessively vigorous stirring can also draw air into the solution through the vortex produced by the stirrer. Use a bagged platinum rod electrode. The bag helps prevent bubbles generated at the anode from reaching the workpiece. Use suitable agitation, but avoid stirring so rapidly that a deep vortex forms and draws air into the solution. Reposition the article if necessary to prevent bubbles becoming trapped in recesses.
Particulate contamination Pits occur randomly and may be accompanied by roughness. Particles temporarily adhering to the surface can interfere with deposition. Filter the solution and eliminate the source of contamination. Check especially for abrasive residues carried in on workpieces and buffing or polishing dust entering the plating area.
Grease or oil contamination on the workpiece Pitting or small areas of poor coverage occur despite otherwise normal plating conditions. Water may bead or pull away from contaminated areas during rinsing. Repeat the surface preparation. Degrease thoroughly, then use the appropriate Spa Plating cleaning and activation process before replating.
Unplated areas
 Inadequate cleaning or activation Gold fails to deposit in isolated areas, often with an irregular boundary. A water-break during rinsing can indicate remaining grease or contamination. Repeat the surface preparation, making sure the article is thoroughly degreased and correctly activated before plating.
Porous, deeply scratched or poorly prepared underlying surface The unplated areas correspond with pores, deep scratches, pits or other defects in the underlying surface. Mechanically prepare or polish the surface to remove the defects before repeating the surface preparation and plating.
Underlying metal is difficult to plate directly Plating is satisfactory on some areas or materials but consistently fails on the particular underlying metal. Check the Process Sequences tab and use the correct preparation and plating sequence for the metal being plated.
Vertical tide marks
 Gas bubbles coalescing and travelling up the surface of the workpiece Vertical streaks or tide-like marks form in the direction that bubbles travel upwards across the surface. Use a bagged platinum rod electrode to help control anode-generated gas. Adjust the position of the workpiece and agitation so that bubbles are carried away rather than travelling repeatedly over the plated surface.
Poor agitation pattern or eddies produced by the stirrer The marks occur in a repeatable pattern and may change or disappear when the workpiece position or stirring speed is changed. Reposition the workpiece or stirrer and adjust the stirring speed to produce good solution movement without strong localised eddies or a vortex.
Deposit peels or blisters
 Inadequate cleaning or activation The gold lifts, peels or blisters from the underlying surface during or after plating. Remove the poorly adhered deposit and repeat the surface preparation, making sure the article is thoroughly degreased and correctly activated before replating.
Incorrect preparation method for the metal being plated Adhesion problems occur consistently on a particular underlying metal even though the surface appears clean. Check the Process Sequences tab and use the correct preparation and plating sequence for the metal being plated.
Existing plating layer is poorly adhered The Gold Tank deposit peels or blisters together with an underlying plating layer. Remove the unstable plating back to a sound, well-adhered surface before replating. A new gold deposit cannot improve the adhesion of an unstable underlying layer.
Deposit built excessively thick without intermediate finishing Adhesion or surface quality deteriorates as a comparatively thick gold deposit is built up. For thicker deposits, follow the Gold Tank Plating Solution instructions for intermediate finishing or polishing rather than attempting to build the full thickness continuously.
Platinum electrode becomes discoloured
 Metallic gold has deposited onto the platinum electrode The platinum rod develops a gold, brown or darker discolouration during use. This is metallic gold deposited onto the electrode and is not detrimental to the functioning of the plating solution, provided the electrode is bagged. No corrective action is normally required. Continue using the platinum rod electrode with a suitable anode bag.

Plating gold on copper, brass and bronze

  • Degrease
  • Electroclean
  • Rinse
  • Acticlean/Activator dip (no power)
  • Rinse
  • Plate a barrier layer of nickel with Nickel Tank Plating Solution to at least 3 microns. If it’s not possible to plate nickel due to specifications, consider an alternative metal like palladium
  • Rinse
  • Gold plate

Note: Some types of brass may be difficult to plate directly with nickel. In this case, plate with Alkaline Copper Plating Solution 5 minutes at plating factor 0.01 A/cm2 prior to nickel plating.

Plating gold on nickel and its alloys (such as nickel silver and Monel)

  • Degrease
  • Electroclean
  • Rinse
  • Plate an adhesion layer of gold with NiPrep
  • No need to rinse, go directly to the gold plating stage
  • Gold plate

Note: nickel and its alloys may also be prepared for plating by gold striking which included below.

Plating gold on stainless steel and difficult-to-plate metals such as surgical instruments and dental alloys

  • Degrease
  • Electroclean
  • Rinse
  • Plate an adhesion layer with Gold Strike Tank
  • Rinse
  • Gold plate

Plating gold on to steel and iron

  • Degrease
  • Electroclean
  • Rinse
  • Plate with Alkaline Copper Tank Plating Solution for 5 minutes at plating factor 0.01 A/cm2
  • Rinse
  • Build up with Copper Tank Plating Solution (see note at end of article)
  • Rinse
  • Plate a barrier layer of nickel with Nickel Tank Plating Solution to at least 3 microns. If it’s not possible to plate nickel due to specifications, consider an alternative metal like palladium
  • Rinse
  • Gold plate

Plating gold on zinc (also see individual product pages)

  • Degrease
  • Electroclean
  • Rinse
  • Microetch in Activator for 1 – 2 minutes
  • Rinse
  • Plate with Alkaline Copper Tank Plating Solution for 5 minutes at plating factor 0.01 A/cm2 (see note below)
  • Rinse
  • Build up with Copper Tank Plating Solution (see note at end of article)
  • Rinse
  • Plate with Nickel Tank Plating Solution to at least 3 microns
  • Rinse
  • Gold plate

Note : For best results, zinc needs to be mechanically finished prior to plating. This we advise polishing, linishing or very fine scratch brushing such as the finish obtained with fine Scotch-Brite™ mops. Attempting to plate on a course scratch brushed surface will result in poor adhesion and unplated areas.

Plating gold on to aluminium

  • Degrease
  • Electroclean
  • Rinse
  • Zincate in Zincate Dip for 30 seconds to 2 minutes
  • Rinse
  • Plate with Alkaline Copper Tank Plating Solution for 5 minutes at plating factor 0.01 A/cm
  • Rinse
  • Build up with Copper Tank Plating Solution (see note at end of article)
  • Nickel plate with Nickel Tank Plating Solution
  • Rinse
  • Gold plate

Plating gold on tin and its alloys (pewter, Britannia metal and solder)

  • Degrease
  • Electroclean
  • Rinse
  • Plate with Alkaline Copper Tank Plating Solution for 5 minutes at plating factor 0.01 A/cm
  • Rinse
  • Plate a barrier layer of nickel with Nickel Tank Plating Solution to at least 3 microns. If it’s not possible to plate nickel due to specifications, consider an alternative metal like palladium
  • Rinse
  • Gold plate

More information about each process can found on the individual product pages.

Note: If the article is expected to be used out doors (for example, car parts), a protective copper layer of at least 10 microns should be plated with Copper Tank Plating Solution after the alkaline copper stage. After this, the article should be removed from the process and mechanically finished (polishing, linishing or fine scratch brushing) prior to nickel plating.

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