Fault
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Possible cause
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Diagnostic clue
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Corrective action
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No plating at all
|
Open circuit / electricity not flowing |
MultiPlater: the red light remains on, indicating that no current is flowing. A third-party power supply shows zero amps. |
Check all electrical connections and contact points. Clean the contact points if necessary. |
| Reverse polarity |
Current may still flow, but gold does not deposit. The workpiece may show signs of anodic attack. |
Correct the polarity: workpiece negative (–), platinum rod electrode positive (+). |
Plating is dull or matt
|
Plating onto a porous or poorly finished surface |
The gold deposit is sound but reproduces the dull, porous, scratched or uneven finish of the underlying surface. |
Polish or otherwise prepare the article to the required finish before repeating the surface preparation and plating. |
| Gold concentration has become depleted through use |
A previously satisfactory solution gradually gives a duller or weaker-looking deposit as gold is removed from the solution. |
Use Gold Tank Replenisher to replace the gold used during plating. Use the Gold Tank Plating Calculator to calculate the amount required. If the present gold concentration is uncertain, the Gold Tank Concentration Calculator can be used as an estimate only; its accuracy is approximately ±1 g/L. |
| Temperature too high |
The deposit becomes dull or matt when the solution is being operated above its recommended temperature range. |
Allow the solution to return to the recommended operating temperature before continuing. |
| Low conductivity / excessive voltage required |
The required amps can only be obtained at an unusually high voltage. On the MultiPlater, the operating indication may show that excessive voltage is being required. |
Check electrical contacts, solution level, electrode position and the condition of the platinum rod electrode. Do not attempt to alter the solution chemistry. |
| Organic contamination |
The deposit remains dull or matt despite the normal operating conditions being correct. |
Treat the plating solution with Carbon Powder in accordance with Spa Plating’s instructions to remove organic contamination. |
Burnt deposit, especially on corners and edges
|
Amps too high |
The deposit becomes dark, burnt or powdery, usually first on corners, edges and other high-current areas. |
Check the surface area and use the Gold Tank Plating Calculator to determine the correct amp setting. Reduce the amps if necessary. |
| Article too close to the electrode |
Burning is localised on the area closest to or directly facing the platinum rod electrode. |
Increase the distance between the article and electrode or reposition them to obtain a more even current distribution. |
| Too little agitation |
Burning or darkening is concentrated in high-current areas and solution movement around the workpiece is poor. |
Increase agitation to the recommended level and make sure there is good solution movement around the whole article. |
| Temperature too low |
Burning occurs when the solution is below its recommended operating temperature. |
Raise the solution to the recommended operating temperature before continuing. |
Solution level falling
|
Evaporation losses |
The solution level gradually falls during use or storage, particularly when the solution is warm or left uncovered. Evaporation removes water but leaves the gold and other dissolved constituents in the bath. |
Replace evaporated water with deionised or distilled water to restore the original working level. Do not use Gold Tank Replenisher to replace evaporated water. |
| Dragout |
Plating solution is carried out on workpieces and holders when they are removed from the bath, particularly where solution collects in holes or recesses. This removes gold and other dissolved constituents as well as water. |
Allow workpieces and holders to drain back into the plating bath before rinsing. Position articles so that trapped solution can drain from holes and recesses. Replace solution lost through dragout with fresh Gold Tank Plating Solution. Water alone will not replace the lost gold and other dissolved constituents. |
Gold concentration has fallen / solution needs replenishing
|
Gold has been removed from the solution during plating |
Gold is removed from the plating solution as it is deposited onto the work. As the bath is used, the gold concentration will gradually fall unless it is replenished. |
Use Gold Tank Replenisher to replace the gold used during plating. Use the Gold Tank Plating Calculator to calculate the amount required. |
| Uncertainty about the present gold concentration |
The bath has been used for some time and the current gold concentration is not known. |
Use the Gold Tank Concentration Calculator to estimate the gold concentration. This is only an approximate guide and may have an error of approximately ±1 g/L, so it should not be regarded as an accurate analysis. |
| Uncertainty about gold turnovers |
A 1 litre bath initially contains 4 g of gold. Gold Tank Replenisher contains 16 g/L gold, so replacing 4 g of gold requires 250 ml of replenisher. This is one gold turnover. |
Keep a record of the cumulative amount of Gold Tank Replenisher added. Five turnovers corresponds to 20 g of gold, or 1.25 litres of replenisher per litre of original bath. Six turnovers corresponds to 24 g of gold, or 1.50 litres of replenisher per litre of original bath. |
| Bath has reached the recommended turnover limit |
The bath has received approximately 5–6 gold turnovers. This means a cumulative addition of approximately 1.25–1.50 litres of Gold Tank Replenisher for each litre of original bath. It does not mean five or six individual replenishment additions. |
Replace the bath rather than continuing to replenish it indefinitely. As the bath approaches exhaustion it can become overloaded with potassium and potassium salts may begin to crystallise out. |
Incorrect plating thickness
|
Incorrect surface area estimated or calculated |
The measured thickness differs from the target even though the calculated amp setting and plating time were used. Irregular shapes, edges, recesses and multiple surfaces are easily underestimated. |
Recheck the total surface area in cm² and enter the corrected area and required thickness into the Gold Tank Plating Calculator. If you are unsure how to estimate the surface area, ask our Technical Assistant for help. |
| Temperature differs from that used for the calculation |
The calculated amp setting and plating time have been followed, but the measured thickness is consistently higher or lower than expected. |
Check the actual solution temperature and use the Gold Tank Plating Calculator with the appropriate temperature setting. |
| Agitation differs from that used for the calculation |
The calculated plating time has been followed, but the measured thickness differs from the target. |
Check that the actual agitation corresponds with the setting used in the Gold Tank Plating Calculator. |
Deposit is bright but rough
|
Particulate contamination of the plating solution |
The deposit retains its normal bright gold appearance but develops a rough or gritty surface. A common source is abrasive residue carried into the solution from the workpiece, particularly material trapped in holes, recesses and relief work. Dust from buffing and polishing machines is another major source of particulate contamination. |
Thoroughly rinse and inspect workpieces after polishing or abrasive preparation, paying particular attention to holes, recesses and relief work. Keep the plating area and solution protected from buffing and polishing dust. If contamination has entered the solution, filter it through suitable filter paper or use continuous cartridge filtration. |
Deposit is pitted
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Gas bubbles reaching or adhering to the workpiece |
Small pits or pinholes appear where gas bubbles have contacted or remained on the surface. Gas is generated at both electrodes, with a substantial proportion generated at the anode. Excessively vigorous stirring can also draw air into the solution through the vortex produced by the stirrer. |
Use a bagged platinum rod electrode. The bag helps prevent bubbles generated at the anode from reaching the workpiece. Use suitable agitation, but avoid stirring so rapidly that a deep vortex forms and draws air into the solution. Reposition the article if necessary to prevent bubbles becoming trapped in recesses. |
| Particulate contamination |
Pits occur randomly and may be accompanied by roughness. Particles temporarily adhering to the surface can interfere with deposition. |
Filter the solution and eliminate the source of contamination. Check especially for abrasive residues carried in on workpieces and buffing or polishing dust entering the plating area. |
| Grease or oil contamination on the workpiece |
Pitting or small areas of poor coverage occur despite otherwise normal plating conditions. Water may bead or pull away from contaminated areas during rinsing. |
Repeat the surface preparation. Degrease thoroughly, then use the appropriate Spa Plating cleaning and activation process before replating. |
Unplated areas
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Inadequate cleaning or activation |
Gold fails to deposit in isolated areas, often with an irregular boundary. A water-break during rinsing can indicate remaining grease or contamination. |
Repeat the surface preparation, making sure the article is thoroughly degreased and correctly activated before plating. |
| Porous, deeply scratched or poorly prepared underlying surface |
The unplated areas correspond with pores, deep scratches, pits or other defects in the underlying surface. |
Mechanically prepare or polish the surface to remove the defects before repeating the surface preparation and plating. |
| Underlying metal is difficult to plate directly |
Plating is satisfactory on some areas or materials but consistently fails on the particular underlying metal. |
Check the Process Sequences tab and use the correct preparation and plating sequence for the metal being plated. |
Vertical tide marks
|
Gas bubbles coalescing and travelling up the surface of the workpiece |
Vertical streaks or tide-like marks form in the direction that bubbles travel upwards across the surface. |
Use a bagged platinum rod electrode to help control anode-generated gas. Adjust the position of the workpiece and agitation so that bubbles are carried away rather than travelling repeatedly over the plated surface. |
| Poor agitation pattern or eddies produced by the stirrer |
The marks occur in a repeatable pattern and may change or disappear when the workpiece position or stirring speed is changed. |
Reposition the workpiece or stirrer and adjust the stirring speed to produce good solution movement without strong localised eddies or a vortex. |
Plating fails the adhesive tape test or peels
|
Inadequate cleaning or activation |
The gold fails the adhesive tape test or subsequently peels from the underlying surface. |
Remove the poorly adhered deposit and repeat the surface preparation. Make sure the article is thoroughly degreased and correctly activated where activation is required before replating. |
| Incorrect preparation method for the metal being plated |
The plating fails the adhesive tape test or adhesion problems occur consistently on a particular underlying metal even though the surface appears clean. |
Check the Process Sequences tab and use the correct preparation and plating sequence for the metal being plated. |
| Existing plating layer is poorly adhered |
The plating fails the adhesive tape test or peels together with an underlying plating layer. Examine the underside of the material removed by the tape. Its colour can help identify which plated layer has failed. For example, a gold-coloured underside indicates failure at the gold interface, while a silver- or copper-coloured underside indicates that the silver or copper plated layer respectively has failed at the interface beneath it. |
Remove the unstable plating back to a sound, well-adhered surface before replating. A new gold deposit cannot improve the adhesion of an unstable underlying layer. |
| Deposit built excessively thick without intermediate finishing |
Adhesion or surface quality deteriorates as a comparatively thick gold deposit is built up. |
For thicker deposits, follow the Gold Tank Plating Solution instructions for intermediate finishing or polishing rather than attempting to build the full thickness continuously. |
Platinum electrode becomes discoloured
|
Metallic gold has deposited onto the platinum electrode |
The platinum rod develops a gold, brown or darker discolouration during use. This is metallic gold deposited onto the electrode and is not detrimental to the functioning of the plating solution, provided the electrode is bagged. |
No corrective action is normally required. Continue using the platinum rod electrode with a suitable anode bag. |